FBC Laser Wire Strippers Have Been Adopted for High-Precision Coaxial Cable Processing Used in Semiconductor Testers That Support Semiconductor Manufacturing for AI Data Centers.
In recent years, with the rapid proliferation of generative AI, demand for servers equipped with high-performance GPUs has been growing in AI data centers. As GPU processing performance improves, there is an increasing need for faster and more precise semiconductor inspection of the memory components—such as NAND and DRAM—and SoCs used in these systems.
Inside semiconductor inspection equipment, numerous high-frequency, high-precision coaxial cables are used to transmit inspection signals with high accuracy. To maintain signal quality, the outer conductors and dielectrics of these coaxial cables must be terminally processed with high dimensional accuracy.
However, as coaxial cables become thinner and more densely packed, conventional machining methods often face challenges regarding dimensional stability, processing quality, handling of fine details, and productivity when processing large numbers of cables.
The FBC laser processing machine adopted for this project uses non-contact laser processing to machine the coaxial cable’s jacket, dielectric, and shield with high precision. It also allows multiple coaxial cables to be efficiently arranged within the processing area and processed simultaneously.
Compared to the conventional method of processing cables one at a time, this approach efficiently processes large numbers of coaxial cables, contributing to shorter processing times and improved productivity.
Furthermore, the FBC laser processing machine aims to consistently achieve high-quality, high-precision processing—even for fine terminal shapes—through proprietary processing technology that combines the laser optical system, processing conditions, and position control.
This adoption serves as a case study demonstrating that the FBC laser processing machine can contribute to improving the productivity and processing quality of high-precision coaxial cables in the manufacturing of semiconductor inspection equipment that supports the rapidly expanding AI data center market.
Moving forward, we will continue to develop and provide high-precision, high-productivity laser-based terminal processing technologies to meet the demands for increasingly miniaturized, high-density, and high-performance cables in the AI, semiconductor, and high-speed communications sectors.